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Dispense Die Bonder Product List

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12-inch wafer compatible high-speed high-precision twin dispense die bonder

12-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

  • Bonding Equipment
  • Dispense Die Bonder

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8-inch wafer compatible high-speed high-precision twin dispense die bonder

8-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Best TCO 　~Small footprint, reduced changeover time~ ◆Best Quality 　~Supports fast-drying paste~ ◆Wide lead frame compatibility 　~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system 　~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup 　~Supports sizes from 0.15 to 8.0mm~

  • Other semiconductors
  • Bonding Equipment
  • Dispense Die Bonder

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